Used DISCO DAD 3350 #293605308 for sale

Manufacturer
DISCO
Model
DAD 3350
ID: 293605308
Wafer Size: 6"-8"
Vintage: 2014
Dicing saw, 6"-8" Si Wafer and SiC 2014 vintage.
DISCO DAD 3350 is a state-of-the-art scribing and dicing equipment designed for automated segmentation of multi-dimensional materials including glass slides, single-mode fibers, and nontypical substrates. This system uses hardened steel and diamond cutting techniques to perform precise and accurate dicing of surfaces and substrates up to 2000 μm thick, in a variety of sizes, shapes, and curvatures. DISCO DAD3350 has a unique, user-friendly interface and incorporates automated high speed cutting capabilities, allowing for extremely accurate dicing and segmentation of substrate surfaces. This unit features a joystick that enables the user to control the diamond and tools, while scoring and scribing the surfaces in an automated manner to achieve the desired configuration. The machine can be programmed to allow for greater flexibility, enabling the user to customize the process steps, as well as adjust the cutting speed and pressure to optimize the end result. The tool features a dynamic selection of cutting tools and toolsets to suit virtually any substrate surface. From the control panel, different diamond-cutting parameters can be set, making DAD 3350 a versatile asset suitable for a wide range of applications. The model also has the capacity to carry out simultaneous cutting of multiple substrates for batch processing. In addition, DAD3350 has powerful visualization capabilities, allowing for a comprehensive overview of the cutting process. A camera located atop the equipment permits the user to view the substrate surfaces in real-time, providing a direct link between the machine and the user. This ensures highly accurate cuts and rapid feedback for process optimization. DISCO DAD 3350 scribing and dicing system is a valuable tool for researchers and engineers in the optical, electronic, and medical industries. Its advanced features and precision-control capabilities make it an excellent choice for anyone in need of reliable and automated segmentation of any type of substrate surface.
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