Used DISCO DAD 3350 #9228290 for sale

DISCO DAD 3350 is a powerful scribing/dicing equipment designed to make semiconductor processing easier. It incorporates several advanced technologies that allow users to easily create precise cuts in silicon wafers and other difficult to process substrates. Utilizing a comprehensive control system and software, the unit can be used for chip production as well as for research and development applications. The main components of DISCO DAD3350 include a dicing saw, a scribing head, a rotary stage and a printed circuit board. The dicing saw features an adjustable high-speed diamond-tipped blade to quickly and accurately cut through silicon wafers and other substrates. The machine also includes an advanced scribing head that enables users to define and design precise structures with a minimal amount of material waste. The rotary stage ensures precise positioning, and allows users to precisely control the motion of the scribing head. The tool also includes a printed circuit board, which allows users to wirelessly control the asset's components. DAD 3350 is designed to save users time and money, while delivering top-notch performance. It is equipped with several safety features such as a laser safety interlock model that protects users from dangerous laser radiation and a protective dust-proof cover to keep debris away from the components. The equipment also incorporates several automated functions, such as automatic head alignment, automated substrate movement and a vision-guided system for precise positioning. Additionally, DAD3350 also includes a wide range of additional features, such as a high-precision multi-axis platform and compatibility with various software solutions. All of these features enable users to create and produce high-quality, accurate components more quickly and efficiently. Overall, DISCO DAD 3350 is an advanced, powerful unit designed to make semiconductor processing easier and more efficient. With its precision and automated functions, this machine is ideal for chip production and research and development applications.