Used DISCO DAS 651L #293643331 for sale

DISCO DAS 651L is a scribing and dicing equipment used for semi-conductor wafer processing. The system is used for applications where aligned cutting or scoring of the wafer into defined shapes is required. The unit is equipped with an XYZ-motorized 5-axis machine that utilizes an ultra-precise ball-screw drive tool. The asset ensures perfect positioning accuracy and repeatability. The ball-screw drive model also allows for more precise and accurate cutting and scribing. DAS 651L equipment uses a laser beam with a diameter of 125 micrometers, to cut and score the wafers. The laser has a maximum speed of 3.2 mm/sec and has the ability to make cuts between 0.5 and 5 micrometers in thickness. The system is further equipped with an auto-focusing unit that enables it to cut or score in any shape and size. This machine also prevents any damages to the chips and also enhances accuracy. The tool is largely automated and can be operated from a central control unit. This ensures that the asset is highly efficient and reliable. The model is designed to be user friendly and can be customized as per user needs. The central control unit can also be used to monitor the entire cutting and scribing process. DISCO DAS 651L is a highly efficient and precise equipment for processing the delicate micro-electronic wafers. With its highly precise cutting and scoring, the system ensures high quality products and extended life of the wafer. The unit is also user-friendly and is capable of producing high quality products within a short time period. The machine is also reliable and cost effective, making it an ideal tool for any semiconductor wafer processing industry.