Used DISCO DC 4001 #9145029 for sale

DISCO DC 4001 is a scribing / dicing equipment used to cut substrates into smaller pieces in the production of semiconductor devices. This system utilizes a high-speed scribing process to accurately cut substrates made from materials such as glass, quartz, and ceramic into a variety of shapes, sizes, and thicknesses. The unit is capable of a wide range of production speeds up to 250 cuts per second as well as accuracy rates down to ±80 µm. DC 4001 features a four-axis X-Y-Z-B configuration providing vertical and horizontal cutting capabilities and an interchangeable objective lens for scribing multiple substrates at variable depth with adjustable cut width, direction, and frequency. The objective lens is made up of a diamond-tipped scriber wheel delivering precise and powerful dead-point downward force viasolutions offers tool positioning accuracy up to 25µm which combined with quality objective lenses and rigid structural engineering provides superior performance and reliability during extended periods of operation. The machine includes intuitively designed hardware and software components that allow for easy operation and monitoring. The software consists of tool menus built for maximum control and efficiency as well as fault display indications. The hardware assembly includes hydraulics to move the scriber wheel and interlocks to ensure product safety and reduce asset maintenance requirements. Additionally, the optional Dynamic Cut check feature monitors and automatically adjusts for changing substrate surfaces every few tenths of a second. DISCO DC 4001 offers a unique design that is both user friendly and easy to maintain, allowing for rapid production, and customizable cutting capabilities. The highly versatile machine offers an array of features that can be tailored to user preferences, which can include advanced safety measures, operational monitoring and control software, as well as tooling solutions for difficult and complex operations. This model is ideal for fast, precise cutting applications and is used in the manufacture of semiconductor components, LCD substrates, and other electronic components.