Used DISCO DFD 620 #9197097 for sale

DISCO DFD 620 is a one-in-all scribing and dicing equipment designed for advanced semiconductor wafer processing. This system can be used to perform a variety of tasks related to wafer processing such as advanced cutting, slicing, dicing, and drilling operations. With its highly advanced Dicer module, it is capable of achieving a high level of precision through precise scribing and dicing operations. The Dicer module is capable of producing up to 600 wafer scribing/dicing operations per hour and its high-end scan head and dicing software allow for precise control of cutting paths. Additionally, the machine also features a enhanced Image Recognition unit that allows for accurate alignment and positioning to ensure precise scribing/dicing operations. DISCO DFD620 also features a load and unload station that permits quick and efficient mounting of the wafer to be processed. This, coupled with a vision machine and a motion control tool, enables the operator to focus on maximizing efficiency and production volume. DFD 620 is also equipped with a manual mode, which can be used to program and perform trial operations before orchestrating the actual production sequencing. Furthermore, the asset's advanced On Strike feature allows the operator to quickly be alerted and intervene appropriately during the production process in case of unexpected events. DFD620's dicing capacity was designed to maximise the efficiency of wafer production. Its automated setup allows for quick and easy wafer transport, and its functions can be adjusted to provide manufacturer specified sequence and gap settings for increased production precisions. This model is also equipped with Fine Feed adjusters for modifying feed positioning and pitch, allowing for highly accurate dicing operations. In terms of safety, DISCO DFD 620 incorporates a triple layer particle filter equipment and laser diode collimators for a clean working environment. This system also offers an optional clean room package, which meets Class 10K cleanroom standards. Overall, DISCO DFD620 is a reliable and cost-effective scribing and dicing unit, equipped with all the necessary features for performing advanced wafer processing operations with a high level of precision. Its automation capabilities and fine tuning options allow for increased production efficiency and decreased risk of error, making it well suited for high-volume production facilities.