Used DISCO DFD 6340 #293635187 for sale

DISCO DFD 6340 is a precision scribing / dicing equipment designed to cut and dice a wide variety of materials, including ceramic and semiconductor substrates. The system utilizes a high-precision laser beam micrometer to accurately cut semiconductor substrates, to enable applications requiring reliability and high accuracy in the production of electronic components and substrates. The unit is capable of cutting materials up to 1.6mm in thickness, and features a feed step size of 20 microns in one direction, and 40 microns in the other. Additionally, DISCO DFD6340 is capable of performing scribing, dicing, and microdrilling for maximum versatility. The machine is also equipped with an integrated camera module and can scribe a line either forward or backward. DFD 6340 operates at a wavelength of 1064nm, with a pulse width of 0.2ms to 6.4ms and a pulse repetition rate of 20Hz to 200kHz. It provides a maximum speed of 19mm/sec. and can achieve a precision of ±2 microns with 30 lines/mm. This makes the tool perfect for applications requiring a high degree of accuracy. The laser beam micrometer provides a high throughput of up to 1,000mm/min, while keeping the quality of the cut edge high even when cutting thick materials. The asset features an integrated user-friendly graphical programming interface with automatic optimization, guiding users through required steps for programming processes. It also features multiple language support functions, making the model suitable for worldwide use. The equipment features a fieldbus port, allowing it to communicate with an external PC or PLC controller. DFD6340 can be utilized in applications ranging from electronic device production to semiconductor processing. It is suitable for cutting and scribing silicon wafers, ceramics, substrates and other hard materials. In addition, the system can be used for marking, cutting, and drilling common materials used in the assembly of electronic components, including silicon, ceramics, epoxy, and PCBs. By utilizing advanced laser cutting technology, DISCO DFD 6340 added unmatched accuracy to the production process. Additionally, this unit's advanced features, including its graphical programming interface, user-friendly operation and multiple language support functions contribute to efficient, reliable, and cost-effective production of electronic substrates and components.