Used DISCO DFD 6340 #9128652 for sale

DISCO DFD 6340 is a scribing and dicing system widely used in the semiconductor industry. It is specifically designed to provide a high-accuracy scribing and dicing solution for substrates and wafers of up to 6 inches in diameter. The scribing and dicing process with DISCO DFD6340 involves laser-guided excimer laser dicing, diamond scribe wheel etching and wet-etch back grinding. The laser dicing process is used to cut a variety of materials, such as SiC, diamond, GaAs and sapphires. The diamond scribe wheel etching is used to create precise micro-cuts on materials such as hard metals and diamond. Finally, the wet-etch back grinding process is used to create shallow cuts on both brittle and hard metals without damaging the surface. DFD 6340 consists of a series of components. The diamond scribe wheel is driven by a precision linear stage and its position can be precisely controlled for accurate dicing and scribing. The laser is a XeCl excimer laser with an output energy of up to 600 mJ, delivering a high degree of cutting accuracy and precision due to the tight beam control. A 3018SC high speed linear stage is used to accurately position the stage and deliver the laser beam to the scribing area. The high speed linear stage provides repeatability of 0.05 microns and accuracy of 0.2 microns with a speed of up to 10 m/sec. DFD6340 is equipped with software that helps to handle complex dicing and scribing programs. It allows the user to set cutting parameters such as the number of cuts, the distance between cuts and the etching depth. The software also features a graphical interface that allows the user to visualize the scribed lines and the cutting parameters. DISCO DFD 6340 is a highly reliable, high-performance system with a robust design and construction that allows for easy maintenance and durability. This system is designed to provide a cost-effective solution for accurate scribing and dicing applications.