Used DISCO DFD 6340 #9157643 for sale

DISCO DFD 6340 is a state-of-the-art scribing/dicing equipment designed for the dicing of high-precision substrates such as silicon, quartz, and glass. The system's dual-axis laser cutting technology enables spinning of substrates at high speeds, allowing for quick and clean cuts. This unit comes with a host of features such as a high-resolution vision machine, advanced control software, and automatic wafer handling capabilities. With its advanced control software, DISCO DFD6340 offers a user-friendly and intuitive interface for programming job requirements. It can be configured for scribing, dicing, re-patterning, and other precision cutting processes. The tool can also be used for marking substrates and other materials with its laser mark-recognition feature. In addition, DFD 6340 is capable of making cuts with a depth as small as 1 nanometer. The asset utilizes a high-resolution vision model that senses the exact locations of each scribe, cut and perforation, which makes it ideal for precision cutting applications. It also features advanced motion control algorithms to ensure that each cut is made without any errors and to the highest degree of precision. DFD6340 is fully compatible with a range of substrates, including thin substrates, thin-film substrates, and etched silicon wafers. The equipment is also able to process large quantities of substrates with its automated wafer handling capabilities. By using the automatic wafer load/unload system, the unit is able to quickly and accurately transfer substrates from one station to the other for processing. DISCO DFD 6340 is also equipped with an integrated dust extractor unit to ensure a clean work environment. Overall, DISCO DFD6340 is an excellent choice for precision cutting and scribing applications. It offers high accuracy, high speed and a host of features that make it a reliable, user-friendly and cost-effective solution for various applications.