Used DISCO DFD 6340 #9172166 for sale

DISCO DFD 6340 is a scribing/dicing equipment designed for precision cutting and drilling of wafers. It is capable of accurately scribing lines and cutting through sections of a wafer up to 3" in diameter. The system utilizes a precision laser scriber that can apply scribes with an accuracy of ±10µm. This makes it ideal for applications where accuracy and repeatability of scribe lines is crucial, such as in semiconductor device fabrication. The unit includes a laser beam delivery unit, a 12-inch viewing monitor, and a control panel interface for setting and running the scribing/dicing program. The laser beam delivery unit is equipped with an adjustable X-Y stage machine that allows precision alignment of the laser to the wafer. The automatic X-Y adjustment feature enables the laser to be adjusted in the X-Y coordinates until the desired laser-to-wafer alignment is achieved. This ensures precise scribing and cutting of the wafer. The tool also includes a precision scribing/dicing head for precise cutting/drilling of various wafer materials. The scribing/dicing head is equipped with a rotary blade asset which has an adjustable rotation speed. The speed of the blade can be adjusted according to the material being cut/drilled, giving the user precise control over the cutting/drilling process. DISCO DFD6340 scribing/dicing model can handle up to 150 wafer sections per hour, enabling rapid and efficient production of wafers. The equipment also includes powerful post-processing software to enhance data analysis and record-keeping for jobs completed. The software allows for quick retrieval of job-based report data, which can be used to improve efficiency of production over time. Overall, DFD 6340 is an advanced scribing/dicing system that provides accurate and repeatable cutting and drilling of wafers with high-speed production rates. With its precision laser scriber and adjustable blade mechanism, it is the perfect choice for applications where precision and speed are required.