Used DISCO DFD 6340 #9186829 for sale

DISCO DFD 6340 is a sophisticated scribing/dicing equipment designed for precision and cost-efficient integrated circuit (IC) fabrication processes. This system enables the production of advanced semiconductor materials with superior die size, shape, and performance. It also facilitates higher yield rate, enhanced throughput, and reduced downtime for a wide range of IC production applications. DISCO DFD6340 features a high-performance operating unit that is capable of executing multiple processing tasks simultaneously. It also has smart visualization software, advanced die recognition capabilities, and intuitive control functions. The machine is capable of working with a variety of chip materials, including SiC, GaN, and Diamond and can apply a variety of scribing and dicing techniques, depending on the application. It is powered by three ultra-precise, high-speed die motion stages, which offer high repeatability and accuracy during the scribing process. The tool features a maximum scribing speed of 10m/s and a maximum dicing speed of 5m/s. The scribing mode has the ability to cut even the toughest of materials with precision and without damage to the wafer. It can support a wide range of scribing techniques and die forms, thanks to its advanced software programming. The dicing mode is designed to efficiently cut hard and brittle materials into highly precise small chips. It offers lightning-fast operation, uniform chip sizes, and low noise and contamination. The asset also offers accurate measurement functions for checking the chip thickness, length, and trim size before the final cut. In addition, DFD 6340 is equipped with a configurable laser scribing option, which provides a high-end scribing solution for high-frequency applications. This laser scribing model is integrated with the equipment hardware, reducing setup times and minimizing downtime. DFD6340 offers a wide range of small-scale customization options, such as flexible alignment, segmentation, and trimming, along with a unified operation interface. This can be beneficial for foundries and IC makers alike, as it eliminates the need for manual chip handling and provides technical support in the form of a reliable scribing and dicing solution.