Used DISCO DFD 6340 #9206542 for sale

DISCO DFD 6340 is a "scribing / dicing" equipment designed to take thin wafers and prepare them for dicing or other thinning processes. It is a stand-alone thinning/dicing system consisting of a single frame, capable of operating at synchronous speeds of up to 4.2 m/min. The primary operation performed is sawing, which is done with a high-torque spindle and a diamond blade tailored for the job. A through-transmission measurement unit is built in, providing non-contact control of the wafer sawing parameters both during the cutting process and at its destination. The machine is height adjustable, allowing it to accommodate wafers up to 0.8mm thick. It can accommodate wafers up to 300mm in size and it also has an optional jigged knife holder, enabling it to cut multiple wafers in a single pass. It uses a vacuum table to secure the wafers during cutting and the lateral transport direction is adjustable so that different patterns can be created in the same pass. The feed speed is programmable, allowing optimal surface argumentation while maintaining precision. DISCO DFD6340 can achieve a cut accuracy of ±25 μm which is highly recommended for achieving smooth cuts and preserving the surface integrity of the wafers. The scope of its operations is from dicing, lapping, and scribing of semiconductor wafers. It sets itself apart from other industrial equipment by providing advanced machining capabilities, such as the ability to create meandering lines on the surface of the wafer. It can also be used for patterning and trimming wafers in order to achieve the desired outcomes. In terms of its visual interface, DFD 6340 has a simple and intuitive touch screen panel for convenient operation and monitoring. This user-friendly design as well as its fully-dedicated software package make this machine user-friendly and easily integrable into different laboratory and production environments. Overall, DFD6340 is an ideal tool to achieve precise and accurate scribing/dicing of thin wafers at high productivity rates.