Used DISCO DFD 6340 #9250221 for sale

DISCO DFD 6340 scribing / dicing equipment is designed for the precise high-speed cutting of hard and brittle materials such as semiconductor substrates and circuit boards. Utilizing a high pulse laser and precision mechanical system, DISCO DFD6340 is capable of slicing materials with a scribing depth up to 150 µm and dicing widths of 50-76 µm. The fully automated unit features a programmable scribing/dicing speed of up to 1 kHz and can accommodate substrates up to 200 mm in diameter. DFD 6340 utilizes a UV pulsed laser source with a maximum pulse energy of 130 mJ. This powerful laser is used to etch a series of laser lines on the surface of the material, creating a template for the knife-edge cutting process to follow. An advanced polarization modulator ensures extremely high beam purity, resulting in a smooth scribe line. The scribing/dicing process is performed by a precision 3-axis servo motor-controlled knife-edge cutting machine. A patented nozzle suction design efficiently secures the workpiece against the chopping block while removing debris throughout the cutting process. Additionally, the substrate is continuously rinsed with deionized water during the scribing/dicing process to increase the longevity of the laser and edge blades. DFD6340 is compatible with a wide range of hard and brittle materials. This includes but is not limited to silicon, quartz glass, silicon oxide, and many polymer materials. This tool also features an automated blade edge detector and warning asset. If the blade edge is found to be deformed, degraded, or damaged beyond a certain level, the model automatically halts operation and requires blade replacement. Overall, DISCO DFD 6340 is a powerful and highly accurate scribing/dicing equipment. With its advanced features, this system is an ideal choice for etching, trimming, and dicing hard and brittle materials with precision.