Used DISCO DFD 6340 #9279161 for sale

DISCO DFD 6340 is a high performance scribing/dicing equipment manufactured by DISCO Corporation, a leading supplier of precision semiconductor wafer processing equipment. The system is designed to handle 300mm diameter wafers with a thickness of up to 0.3mm, and has a wafer chucking force of 20 kN. The fundamental objective of DISCO DFD6340 is to accurately meaning scribe lines, squares and other complex patterns to create diced chips of uniform dimension for the semiconductor manufacturing process. The unit is equipped with a three-axis moving stage which is capable of positioning the wafer with an accuracy of +/- 2µm. Its main components include a high power UV-laser, a telecentric zoom microscope imaging machine, a control tool and a computer interface. The UV laser is an adjustable CO2-Type that has a beam wavelength at 10.6 µm, and is capable of producing a beam power of up to 300W. It also has a capability of producing beam diameters of up to 250 µm, which is more than enough to scribe and dice chips of small dimension. The optical asset includes a high-magnification telecentric zoom microscope, automated microscope level control, and a 6-axis autofocus model. Its main function is to provide a clear and real-time image of scribe lines in order to ensure their accuracy. The control equipment is based on C+ language, and allows the user to program intricate patterns and sequences. The computer interface also provides the user with full system control and parameter adjustments. The integrated software allows users to perform functions such as unit monitoring, and automatic parameter updates. Overall, DFD 6340 is an efficient and precise scribing/dicing machine that provides high quality, consistent results. It is capable of processing multiple pattern and types of dice, and is suitable for the needs of various semiconductor manufacturing processes.