Used DISCO DFD 6340 #9361584 for sale

DISCO DFD 6340 is a high-precision scribing / dicing equipment designed for the semiconductor industry. It splits substrate substrates into individual chips and dice substrates. DISCO DFD6340 combines both grinding and jet cutting to provide the optimum scribing and dicing results. It uses a high-precision grinding head and a jet cutter to provide a precise, clean cut. DFD 6340 has a diamond-tipped grinding head for cutting the mask and performing scribing operations. It uses a diamond head to accurately scribe and cut the substrate material. The diamond head is mounted near the end of the grinding device, allowing for the precise scribing and dicing of substrates. The environment of the grinding device's head is kept clean and temperature controlled to ensure accuracy and repeatability of results. The jet cutting device has a jet nozzle which is capable of producing a powerful stream of air or liquid. It is used to precisely cut the surface of the substrate. The jet cutting device is also equipped with a slanted window which allows light to reach the end of the nozzle. This enables the operator to monitor and adjust the parameters of the process, ensuring a clean and precise cut. DFD6340 is equipped with a vision system which is used to locate the alignment marks on the substrate. The vision unit is used to ensure that the substrate is positioned in the correct orientation and is capable of automatic alignment based on the marks identified by the vision machine. DISCO DFD 6340 is designed to be highly efficient, providing excellent accuracy and repeatability. It is also designed to provide accurate and consistent results when scribing and dicing substrates. DISCO DFD6340 is capable of handling a wide range of substrate sizes and materials, making it an ideal tool for a wide variety of applications. It is reliable, efficient, and accurate - making it the perfect solution for the semiconductor industry.