Used DISCO DFD 6340 #9375860 for sale

DISCO DFD 6340 is a state-of-the-art scribing and dicing equipment that is perfect for high-volume semiconductor production. It is used to separate and route out dies from semiconductor wafer strips. The system can handle semiconductor wafers up to 4Dx2" and can slice up to 200 wafers per hour. The unit is able to process wafers without any manual handling, ensuring accuracy and repeatability throughout the entire process. DISCO DFD6340 features a highly precise scribe line and a low-torque motor that is designed to reduce any vibrations that could cause die misalignment or damage during scribing. The die block can be switched quickly between different sizes, ensuring that each job meets the required specifications. The machine is also equipped with an auto positioning tool, which enables precise alignment of the dies after scribing and before dicing. DFD 6340 is capable of processing a variety of material types of up to 8" x 8" in size. It can handle anything from common plastics and metals, to more exotic materials such as fluoropolymers. It also features wafer recognition, which allows for recognition of different types of wafers and can help detect any errors in the production process. The asset also offers a variety of web-based software applications to monitor performance and make adjustments as needed. In addition to its streamlined production capabilities, DFD6340 offers a few other features that make it an ideal choice for semiconductor producers. It comes with an integrated breakage detector, which identifies instances where the die has fractured during the dicing process and can end the job automatically before damage is sustained. The ease of use is also an advantage, as its user-friendly user interface is extremely intuitive and provides just the right amount of customization. Overall, DISCO DFD 6340 is a powerful and versatile scribing and dicing model that ensures accuracy and repeatability throughout the entire process. It is perfect for semiconductor production, as it can handle a variety of materials, provides a user-friendly interface, and integrates both a breakage detector and wafer recognition technology. Ultimately, it is an ideal choice for any die-based semiconductor production process.