Used DISCO DFD 6360 #293606550 for sale

DISCO DFD 6360 scribing/dicing equipment is a precision system designed for dicing and scribing of fragile substrates such as semiconductor chips. The unit consists of a rotary table, laser source, laser optics, XY axes, focusing optics and automated alignment accessories. The table of the machine is a 10-inch diameter aluminum plate and utilizes a ball-screw drive tool with a DC motor and mechanical brake for precise positioning. The rotary table can hold up to four substrates and can be indexed in 1-degree increments by using the step increments. The speed of the rotary table can be precisely controlled between 0 to 100rpm and the brake can be set to hold position with a pressure up to 20N (2kg). The asset is powered by a frequency-doubled Nd:YAG laser sourced capable of producing 35mJ per pulse. The laser is integrated with a synchronized pulse generator, optical pickups and custom optics for high precision cuts. The laser optics includes adjustable focus lens (f=50mm and 100mm) for focal lengths up to 9 inches with a laser spot size up to 300um. The XY stage is capable of high speed positioning with precision and is equipped with an integrated microscope model. The XY stage has orthogonal drive axes and a DC motor with position encoder to ensure precise control over the stage's motion. The micro-metrical resolution of the XY stage equals to 4um in the X axis and 4um in the Y axis, allowing for a high degree of precision when cutting. The automated alignment equipment can be independently adjusted as a collective unit or manually manipulated depending on the application. The alignment system consists of a laser and a guide projector, which can project fiducial marks and targets onto the substrate. The automatics alignment unit is linked with the laser and XY stage, ensuring the accuracy of the cuts. Overall DISCO DFD6360 machine is a high-performance and reliable scribing and dicing tool with a number of unique features. It is ideal for a wide range of scribing and dicing applications for various substrates. The precision of the asset is ensured through the use of quality mechanics, laser optics, XY positioning and automated alignment model, which add to the accuracy and repeatability of the equipment.