Used DISCO DFD 6360 #293639013 for sale

DISCO DFD 6360
Manufacturer
DISCO
Model
DFD 6360
ID: 293639013
Vintage: 2004
Dicing saw 2004 vintage.
DISCO DFD 6360 is a scribing / dicing equipment designed to meet the needs of a variety of customers who require high-precision and reliable cutting of hard materials such as silicon wafers. The system uses laser scribing and multi-axis cutting technology to provide a solution suitable for both manual and automated applications. DISCO DFD6360 consists of an integrated, modular component base with a solid-state laser, an ideal laser source on the market with a power of up to 20W, providing uniform and consistent cutting performance with minimal maintenance. This laser source is combined with the patented CO2 glass optics to produce the exceptional cutting quality and precision. The unit also features an integrated vision machine that allows for fast, accurate alignment and positioning of the material for cutting. This vision tool also provides digital sample inspection. DFD 6360 also incorporates two main axes for multi-axis cutting. The first is an X-Y axis, which provides fast and accurate movements on the same level to allow for more efficient material loading and unloading. The second axis is a Z-Axis which moves up and down to adjust the height of the material. DFD6360 also includes a spindle-controlled diameter pitch asset for finer positioning of the material. The spindle pitch model is capable of both pitch adjustments for different parts and fine adjustments for cutting accuracy and makes it possible to cut different types of materials. With its 9-axis motion equipment, DISCO DFD 6360 also supports non-contact edge grinding and polishing, enabling a smooth finish on the parts. In addition, the system can be integrated with additional optional components, such as a transfer robot, to facilitate the automated loading and unloading of parts to and from the cutting table. In conclusion, DISCO DFD6360 is a high-precision and reliable scribing / dicing unit designed to meet the needs of customers requiring precision cutting of hard materials such as silicon wafers. Its integrated components and multi-axis cutting technology allow for high production yield and consistent cutting quality, making it an ideal solution for automated and manual applications.
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