Used DISCO DFD 6360 #293661840 for sale

DISCO DFD 6360 is an automated equipment that processes semiconductor wafers and substrates through two stages of processing - scribing and dicing. Scribing is the first step of creating dies on a wafer and it involves cutting lines into a material such as silicon. Dicing is the second step and involves cutting out individual die shapes from the wafer. Both steps are done with the precision and accuracy essential for creating an effective semiconductor die. DISCO DFD6360 is capable of handling both scribing and dicing processes with maximum efficiency. It has a "eccentric scriber" with high accuracy and speeds of up to 200mm per second. The eccentric scriber uses a rotating blade, enabling it to scribe extremely accurate, thin lines in the material. The blade's width can be adjusted to adjust the desired line width based on the desired size of the dies. DFD 6360 features a "turret head" which is capable of achieving a variety of scribing and dicing angles. This turret head can also utilize both single- and double-pass processing, which makes it capable of producing small and accurate dies at a high level of precision and speed. The system also has a fully automated wafer handling unit that is capable of handling wafers up to twelve inches in diameter. It also has a vision-based wafer alignment machine that eliminates the need for manual alignment. The wafers are loaded onto the carrier plate before being sent to the scribing and dicing stages. DFD6360 is capable of handling all types of materials, including gems, quartz, and ceramics. It is also compatible with a wide range of applications, such as wiring boards, LCD screens, and solar cells. The tool has high precision and repeatability with low failure rates, making it ideal for high volume production. In addition, it is also equipped with a special "hot data capture" asset that is capable of monitoring all processing data in real-time and providing precise processing control. Overall, DISCO DFD 6360 is a highly efficient and precise model designed for scribing and dicing semiconductors. It is powerful enough to handle large scale production while also maintaining a high level of accuracy and precision for small scale production. The equipment also features a powerful wafer alignment system combined with an automated wafer handling unit that ensures the safe and secure handling of semiconductor wafers and substrates throughout the entire process. This combined with its precision and repeatability make DISCO DFD6360 the ideal machine for automated wafer and substrate scribing and dicing operations.