Used DISCO DFD 6360 #293663360 for sale

DISCO DFD 6360 is an advanced scribing/dicing equipment that is designed for applications requiring precision cutting and machining of materials. This system is designed to be used with various types of materials, including organic and inorganic materials like semiconductor wafers and glass. The unit performs two primary functions: scribing and dicing. For scribing, the machine is equipped with an ultra-precise XY-stage that is capable of precise motion control at resolutions of down to 1.5 μm. This stage can move accurately over the wafer plane and accurately follow the contours of the material being scribed. Additionally, the tool is equipped with a high-speed laser that is capable of scribing with a resolution of down to 10 μm. This allows the asset to level large areas of the material in a single pass. The laser is also capable of marking the fields, edges, and grooves of the material, creating an accurate scribing pattern. Dicing is the process of cutting the material into smaller parts, which is done by the model using a rotating diamond blade. This diamond blade is equipped with a precise motion control equipment that is capable of creating accurate cuts with resolutions down to 25 μm. Additionally, the system is equipped with a pressure equalization unit, which ensures that the material does not deform when the cutting starts. This allows the machine to create precise cuts without marring or distorting the material. DISCO DFD6360 is an advanced scribing/dicing tool that is designed for applications requiring precision cutting and machining of materials. This asset is equipped with ultra-precise XY-stage, a high-speed laser, and a rotating diamond blade with precise motion control. This advanced motion control model allows the equipment to scribe with resolutions down to 10 μm and dice with resolutions down to 25 μm. The system is also equipped with a pressure equalization unit to ensure that the cutting does not deform the material. This makes DFD 6360 an ideal solution for high precision cutting and machining of organic and inorganic materials.