Used DISCO DFD 6360 #293760801 for sale

Manufacturer
DISCO
Model
DFD 6360
ID: 293760801
Wafer Size: 12"
Vintage: 2002
Dicing saw, 12" 2002 vintage.
DISCO DFD 6360 is a multi-functional precision scribing/dicing equipment used for scribing/dicing operations on thin plates and materials. With its high accuracy of 0.3μm in scribing, this system features a built-in laser spot alignment function that ensures the high precision of scribing results, and a multi-stage scriber head and air bearing mechanism to minimize the possibility of damage to materials. The unit enables scribing of semiconductor wafers, hard materials, such as quartz and sapphire, and other thin plates. It uses either laser, diamond-tipped, or carbide-tipped scribing blades for cutting, tailored to the type of thin plate or material being scribed. Its 120 mm peripheral speed and smooth feeding strokes make it possible to perform scribing operations quickly and precisely, with a maximum scribing pitch of 3.2 mm. The machine is also capable of dicing operations, providing a smaller number of dies from the same thin plates. Dicing operations are accomplished using a high power laser operating at a wavelength of 940 nm, which cuts the material deeply and quickly, enabling high-speed and superior quality dicing performance. To avoid mechanical strain during dicing operations, the tool also features an automated beam deflection asset, an XY stage mechanism which increases stability, and an atmospheric pressure control model making use of a separated air supply. DISCO DFD6360 is a precision scribing/dicing equipment that enables efficient and accurate scribing and dicing operations. With its high accuracy and sophisticated handling capabilities, this system is an ideal choice for industries that require precise cuts in thin plates and materials, such as semiconductors, optics and medical devices.
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