Used DISCO DFD 6360 #9157559 for sale

DISCO DFD 6360, is a state-of-the-art scribing, dicing, and wafer fabrication equipment, designed to increase accuracy and productivity. It is a high specification precision system, with an advanced optical alignment unit, allowing it to be used with a variety of substrates. The machine features advanced auto-calibration, ensuring that the X, Y, and Z axes move smoothly and accurately against each other. It is also equipped with high frequency ultrasonic vibration, which increases cut speeds, accuracy, and extended tool life. DISCO DFD6360 is an environmentally friendly tool, with gas management capabilities. This ensures that emissions are minimal, and the need for ventilation within the workplace is removed. It also has a low vibration and sound footprint for user comfort. The core of DFD 6360 is its digital motion control asset, which combines with a high power, high frequency spindle motor. This enables the model to provide straight, smooth and accurate motion. The cutting spindle utilizes a rotary-type drive equipment, enabling it to quickly locate even the most delicate substrates. DFD6360 is a powerful system, capable of handling a wide range of substrates. It is specially designed for high volume applications, offering a variety of dicing operations. The unit is also equipped with an auto-loading/unloading function, which reduces labor input. The machine is protected by a locked fan guard, which encloses the entire spindle area. This barrier prevents dust, dirt, and debris from entering the equipment, keeping it well-maintained and operating efficiently. DISCO DFD 6360 is easy to integrate into a production process. It is compatible with a wide range of materials, including aluminum, tin, and nickel. It also has integrated computerized maintenance programs to help monitor and maintain the tool's health. DISCO DFD6360 is designed for increased throughput, precision and efficiency. It is an innovative and reliable asset, which ensures the highest quality finish for all substrates. It is an impressive and highly advanced wafer fabrication model, which will undoubtedly revolutionize the manufacturing sector.