Used DISCO DFD 6360 #9173538 for sale

DISCO DFD 6360 is a scribing / dicing equipment designed and manufactured by DISCO Corporation. This advanced system is used for precision cutting and processing of materials such as semiconductors, MEMS components, and LCD panel substrates. The unit is also highly suitable for making any kind of pattern from thin films to thick substrates. DISCO DFD6360 consists of an advanced die bonder, a die bonder table, and a laser beam generator. The die bonder table is capable of accepting two 2-D patterns simultaneously, making it suitable for cutting two or more thin films at once. This machine can be configured with either an optical head or a DC laser head. The optical head can cause the laser to be slightly shifted from the edge of the die and can be used to reduce the process time. The DC laser head is designed to accurately etch a single dicing line as well as multi-cut die patterns. The tool is also equipped with a powerful vision asset for high-accuracy etching and cutting. The vision model consists of a high-resolution camera, a high-resolution image processor, and precision lens. The vision equipment is capable of recognizing the exact position of the die, thus enabling very accurate etching and cutting. It also helps to reduce operator intervention time and costs. In addition, the laser beam generator of DFD 6360 is capable of generating a cutting pulse of up to 200W and has power stabilization control. This system also supports various cutting modes, such as single cut mode, multiple cut mode, single-sided mode, and simultaneous cutting mode. This unit is highly efficient, safe, and reliable. It is also highly accurate and has high repeatability, which makes it suitable for precision cutting. Additionally, the machine is compact and can be installed anywhere.