Used DISCO DFD 6360 #9227527 for sale

DISCO DFD 6360 is a scribing/dicing equipment used for high-precision, high-speed assembly processing and testing. It is made by the Precision System Division of DISCO Corporation, and is capable of performing etching, dicing, and scribing operations on both silicon wafers and packaged substrates. The unit features a die-handling robot, a precision die-stacking mechanism, and a powerful die-stacking control software. DISCO DFD6360 utilizes a die-handling robot which is designed to be highly reliable yet highly modular. It has been specially designed to minimize downtime and ensure that no wafer is damaged during operation. The die-stacking mechanism is made up of a dual-axis rotary and Z-axis linear platform, which is capable of making high-precision and secure moves. The die-stacking control software allows for multiple robotic and die-handling operations to be performed in parallel, as well as the possibility of fine-tuning parameters like chopping frequency and speed when needed. The main advantages of DFD 6360 include its high-precision, high-speed assembly of complex components, its built-in protection against particle contamination, its optimized temperature uniformity, and its fully enclosed structure which minimizes the contamination and waste generated during the process. The machine is also highly cost-effective and reliable, guaranteeing optimal performance with minimal environment impact. The scalable and versatile DFD6360 is capable of handling a wide range of components. It is an ideal choice for different applications such as wafer package assembly, e-beam processing, thermal processes, pad processing and many others. The tool has a capacity of up to 450 dies per hour, and its production yield can reach over 95%. With its flexibility, scalability, and high quality, DISCO DFD 6360 is the preferred choice for high-precision and high-speed assembly operations in the semiconductor industry.