Used DISCO DFD 6360 #9242338 for sale

DISCO DFD 6360 is an advanced scribing and dicing equipment designed for easy and precise slicing and dicing of a variety of materials, including large-sized solid substrates or wafers up to 200mm in size. Developed and manufactured by DISCO Corporation in Tokyo, Japan, this equipment is suitable for a range of manufacturing processes, including thin-film transistor (TFT) thin-film coating, and multi-layer circuit board and substrate slicing. DISCO DFD6360 system features a laser scriber that utilizes the latest technology known as 'Selective laser ablation' to ensure precision slicing. This technology allows wavelength control, beam intensity variation, and positioning accuracy to be adjusted to suit the materials being processed. The unit also includes a laser dicer to assist with materials that require highly accurate dicing, as well as a host of other features, including a humidity & temperature control chamber, and a selectable linear stage positioning machine. The range of motion of the linear stage positioning tool is variable, depending on the materials being processed. The stage is designed to achieve accuracy and stability, providing an effective slicing and dicing surface. The controller is user-friendly, with a graphical user interface (GUI) and remote access capability for ease of operation. For safety, DFD 6360 is equipped with safety measures such as an emergency stop asset, laser interlocks, and safety doors to minimise the risk to operators. The safety is further enhanced by a feedback mechanism, which monitors the model to ensure it is functioning safely at all times. In conclusion, DFD6360 is an advanced scribing and dicing equipment that is capable of achieving precision in a wide variety of projects. It is equipped with safety features and offers a host of features and benefits that make it suitable for a wide range of applications.