Used DISCO DFD 6360 #9279427 for sale

DISCO DFD 6360 is a scribing and dicing equipment designed for the semiconductor industry. The system utilizes a laser to create high precision scribes or dices to cut semiconductor wafers and substrate boards, with a tolerance in the sub-micron range. The unit includes DISCO DFD6360 main unit and an attached tool that can accommodate scriber, saw, or laser dicing tools. This allows the user to choose a scriber type relevant to their own specific applications. DFD 6360 machine incorporates advanced motion technology that allows for high accuracy and precision motion control while keeping the noise level to minimal levels. The tool utilizes a Z-Axis controller, air bearing, motor RPM and encoder resolutions to control the stage, providing high speed in all three axes. DFD6360 also incorporates a field-programmable gate array (FPGA) that allows for precise control of instructions, motion control, drive control, and other asset functions. The scribing/dicing model is designed to handle a variety of substrates, including semiconductor wafers, ceramic substrates, and thin substrates. The equipment features an integrated laser system that allows for scribing and dicing with high precision and accuracy. The laser can cut substrates down to a width as small as 50 μm. The unit also supports a variety of pneumatic tools, such as knife scriber, saw scriber, and wire saw. The machine includes an automated compensation and inspection tool to ensure that all scribes or dices are of top quality and accuracy. The asset applies laser compensation and copper compensation to each substrate before it is processed, allowing for a more precise cut. The model is also capable of applied automated curve compensation and laser dicing path modifications for further optimized performance. DISCO DFD 6360 comes complete with a Graphic User Interface (GUI) and powerful software that offers an easy-to-use platform for configuring and operating the equipment. The user can choose from pre-set parameters or create customized settings for different types of substrates and their applications. The system includes a range of safety measures, including interlock, safety fencing, and emergency stop buttons. DISCO DFD6360 is ideal for both small and large production lines and is capable of handling a wide range of substrate sizes. This unit is used for the cutting of semiconductor wafers and other substrates in a variety of industries, including medical, electronics, automotive, and optoelectronics. This scribing/dicing machine features advanced motion technology, an accuracy of less than 1μm, and a powerful integrated environment for accurate and efficient substrate processing.