Used DISCO DFD 6361 #9199161 for sale

DISCO DFD 6361 is a dynamic scribing/dicing equipment specifically designed for yield improvement and material optimization. It utilizes a high-pressure monocrystalline diamond blade to accurately cut semiconductor wafers into units. This scribing system offers industry-leading accuracy and precision, thanks to its cutting-edge low-drag, low-force diamond scribe head and the advanced motion unit. It is the perfect choice for cost-effectively and accurately dividing silicon wafers into chips or dies. The motor of DISCO DFD6361 is designed for optimal performance and high-speed scribing/dicing for arduous applications. Its dynamic cutting head offers consistent cutting speed over a large range, with no vibration and minimal force. Its hydrodynamic bearings minimize the friction of the cutting head and reduce blade wear. Its uniquely designed liquid-filled pedestal offers the perfect combination of reduced vibrations and high cutting speed for optimal performance. DFD 6361 is equipped with a sophisticated, intelligent control machine. This program can be tailored to the specific needs of the user, and it is also able to memorize preceding cutting parameters. The tool has also built-in safety features that protect the diamond blade and prevent cutting errors. The advanced environmental control asset of DFD6361 ensures an ultra-clean ambient air. This keeps the diamond blade free of particles, which could cause problems in the cutting process. It also prevents dust and other debris from entering the interior of the machine. The model has an ergonomic design that allows for comfortable and easy operation. Overall, DISCO DFD 6361 is an incredibly reliable and efficient scribing/dicing equipment for semiconductor wafers. It offers high-end accuracy and precision, with minimal maintenance and low operating costs. This makes it a great choice for any high-volume production environment.