Used DISCO DFD 6361 #9223619 for sale

DISCO DFD 6361 is a scribing / dicing equipment that uses ultra-high precision scribing /dicing technology to provide precise and consistent microfabrication of semiconductor wafers. The system utilizes a high-resolution laser and an advanced 2D scanner to create complex patterns using laser pulses and timing control. The unit is equipped with an integrated software control and monitoring machine to ensure high accuracy and control of the scribing/dicing process. DISCO DFD6361 features a highly precise, self-aligning laser head, which is driven by a high precision stage and stepper motor. This allows for repeatable, precise patterning from one wafer to another. The tool is also fitted with programmable laser spot sizes for more complex patterning, and enhanced diamond-polished cutting blades for higher quality marks. An integrated laser power controller allows for an exact adjustment of beam power output to ensure reliable cutting and marking of the semiconductor wafer material used. DFD 6361 also includes a fast, vision-based wafer placement and pattern registration asset, allowing for easy and accurate registration of wafer coordinates and scribe line start points. The same model also provides precise 2D alignment of the laser head relative to the wafer's edge, as well as its own in-plane/out-of-plane stage movement. Furthermore, the equipment features a monitoring system that not only ensures accuracy and control, but also increases its stability and safety. Overall, DFD6361 offers precise and consistent microfabrication of semiconductor wafers. Its high precision laser head, along with its precise wafer placement and pattern registration, ensure accuracy and control of the process. Furthermore, the integrated software control and monitoring unit enables precise adjustment of laser output for reliable cutting and marking of wafer materials. All of these features make the machine an excellent choice for precise microfabrication.