Used DISCO DFD 6361 #9232870 for sale

DISCO DFD 6361 is an automated scribing and dicing equipment designed for precision semiconductor applications. The system is designed to allow for high-accuracy scribing of the semiconductor material, as well as accurate dicing of the material once it has been scribed. The unit is compact, easy-to-use, and offers outstanding accuracy, speed, reliability, and repeatability. At the heart of DISCO DFD6361 is its advanced laser scribing processor. This processor uses a laser beam to precisely scribe the wafer material into an array of individual frames that make up the semiconductor components. The laser processor is capable of scribing at high speeds - up to 60 scribing operations per second - while maintaining outstanding accuracy and uniformity in each frame. The dicing part of the machine allows for the frames to be accurately dicing with a diamond saw blade, ensuring a clean and precise dicing operation. The dicing motion is driven by high-accuracy positioning stages, allowing for high-precision cutting at a variety of angles for even more precise results. The tool also has a clamp asset built into it, so the operator can easily secure the wafer for safer, more reliable dicing. DFD 6361 model is easy-to-use and highly versatile, capable of handling a variety of different semiconductor shapes and sizes. The equipment is also designed to minimize costs by reducing manual labor and improving efficiency. With its compact size, it can also be integrated into existing production lines without taking up a lot of space. Overall, DFD6361 is a highly reliable and accurate system designed for fast and precise scribing and dicing of semiconductor materials. With its advanced laser processor, precision dicing stages, and secure clamp unit, the machine is capable of producing results with unparalleled accuracy and efficiency. This makes it an ideal tool for those in the semiconductor industry who need accurate and reliable results.