Used DISCO DFD 6361 #9254587 for sale

DISCO DFD 6361 is an advanced semiconductor scribing and dicing equipment. It is designed for high-volume production of wafers with a usage of laser technology. The system uses a high-power laser to scribe a desired shape and depth into the wafer, followed by an air knife to blow out large particles. A special roller dicing saw then applies pressure to the wafer in order to separate small pieces of the wafer. DISCO DFD6361 unit is designed for high-precision cutting for fine pitch production sizes. It is equipped with a dual-beam laser and a rolling/rotating cutting head that provides high accuracy and repeatability. A user-friendly touchscreen interface is also included to maximize usability. The machine also features a shieldless process with no exposure to harmful systems. DFD 6361 has a high speed cutting rate and is capable of producing a variety of separate micro parts with precision of up to 2µm. The tool is also compatible with a range of substrates such as GaAs, Si and Sapphire. Additionally, the asset features a unique wafer-lift mechanism and programmable part cassette collector to ensure safe, automatic wafer stacking and unloading. DFD6361 is an important element of semiconductor device production because of its precision, accuracy and efficiency. It is designed to be user friendly and offers advanced performance to meet the highest industrial standards for accuracy, speeds and throughput.