Used DISCO DFD 6361 #9268226 for sale

DISCO DFD 6361 is a state-of-the-art scribing and dicing equipment which combines both saw-type scribing and laser-based dicing processes in one production system. This cutting edge technology is used in the production of semiconductor wafers for various industries. The unit is capable of handling a wide range of materials, including silicon, gallium arsenide (GaAs), indium phosphide (InP) and gallium nitride (GaN) wafers. It provides a high throughput rate and is equipped with a number of features to ensure precise cutting and high yields. At the heart of DISCO DFD6361 is a scanning machine which allows for precision scribing and dicing of multiple surfaces. The tool is controlled by an intuitive user interface, which provides access to a variety of cutting and positioning parameters as well as the ability to store job recipes and recipes libraries. The asset also incorporates high-speed line tracking and error correction functions to ensure the highest accuracy possible. DFD 6361 also offers several options for material handling, including a responsive vacuum chucking model and an optional internal sample cassette. It is also capable of serialized unique product tracking, allowing for the production of cost-effective, high-yield semiconductor wafers. The equipment is also equipped with a vision system for inspect for breakage and feature recognition, which supports automated production operations. In addition, both fast-forward and slow-slice functions are available for efficient production. DFD6361 is a compact equipment with a small footprint and minimal set-up. The sealed wall construction makes it safe and easy to clean. Additionally, the unit is designed to work with a variety of peripherals, such as lasers, polishing systems and dedicated particle-collection devices. Furthermore, the machine is designed such that it can be used in cleanrooms or factory settings with minimal modifications. Overall, DISCO DFD 6361 is advanced technology designed to maximise efficiency, provide excellent yields and offer outstanding performance. It is a reliable and cost-effective scribing and dicing tool which offers a myriad of features and functions to ensure consistent, high-quality production of semiconductor wafers.