Used DISCO DFD 6362 #9232899 for sale
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ID: 9232899
Vintage: 2012
Dicing saw
Workpiece size: Φ300 mm
X-Axis:
Cutting range: 310 mm
Cutting speed: 0.1 - 1,000 mm/Sec
Y1-Axis:
Cutting range: 310 mm
Index step: 0.0001 mm
Index positioning accuracy:
0.002 / 310 mm (Single error)
0.002 / 5 mm
Y2-Axis:
Cutting range: 310 mm
Index step: 0.0001 mm
Index positioning accuracy:
0.002 / 310 mm (Single error)
0.002 / 5 mm
Z-Axis:
Maximum stroke:
14.7 mm (For φ2" blade)
14.9 mm (For φ3" blade)
Moving resolution: 0.00005 mm
Repeatability accuracy: 0.001 mm
θ-Axis:
Maximum rotating angle: 380°
Spindle:
Rated torque:
0.19 nm (1.2 kW)
0.29 nm (1.8 kW)
0.7 nm
Revolution speed range:
6,000 - 60,000 min^-1
3,000 - 30,000 min^-1
2012 vintage.
DISCO DFD 6362 is a laser based scribing, and dicing equipment that is designed to reduce and decrease material handling throughout the production workflow. It is an integrated system that consolidates several manual steps in the fabrication process into one automated process, making it a highly efficient way of processing substrate materials. DISCO DFD6362 has a working area range of 610mm x 350mm. It has a Y-Axis grade of 65mm/sec that is enabled by an advanced linear motor stage unit that can perform precision dicing and scribing quickly and accurately. This highly accurate dual machine technology also allows for high-volume, repeatable performance of a variety of operations. It is equipped with a large built-in fiber optic laser for scribing and a CO 2 sub-micron laser for high accuracy dicing. The scribing process is carried out with a 10.8 μm wavelength laser that is integrated with digital acoustic technology providing a low stress cutting solution ideal for the processing of soft materials. The combination of 10.8 μm laser and digital acoustic technology helps ensure accurate processing, low stress cutting and highly accurate scribing of the substrate materials. The digital optical tool controls the beam quality, providing precision vision asset that enables precision operation at higher feed rates and lower laser power settings. This allows for precise scribing of the material without causing any thermal damage to the substrate. The dicing process of DFD 6362 operates using a 300MHz CO 2 laser that provides a high quality, non-contact cutting process with high resolution and fine cuts on the material. This laser ensures high speed and accuracy with repeatable results. The Laser head is equipped with Z-drive technology that allows for a wide range of focal length for fine accuracy. The model can also support multiple laser diameters, pitch parameters, optical settings and circle pattern sizes. DFD6362 is designed to provide high-grade, low-cost processing of substrate materials. Its high-speed and repeatable performance makes it an attractive solution for many production and fabrication processes.
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