Used DISCO DFD 6362 #9400883 for sale

DISCO DFD 6362 is a scribing and dicing equipment designed to process panel-like substrates like insulated circuits and PCBs. This high-performance system offers maximum production throughput and expanded design flexibility with an advanced motion control unit. The substrate conveyance machine is designed to handle both rigid and flexible substrates to maximize processing efficiency. The movement of the scriber/dicer is commanded by an industrial Personal Computer (PC) with a dedicated graphic user interface (GUI). The control tool allows for intuitive set-up and is capable of complex but repeatable movement patterns. The asset uses a Direct Drive tool head that provides high speeds with low noise and vibration levels. This ensures that frequency-sensitive components are not damaged. The scriber/dicer has a vision registration capability that is capable of automatically completing registration of fiducials or image markers. The scribing/dicing model is designed to maintain a high level of accuracy on intricate cuts through its Design For Manufacturability (DFM) capabilities. It offers a combination of high-end lasers and fatigue-resistant diamond scriber blades. This allows for the scriber/dicer to achieve a cutting depth up to 13.4 mm. The Control equipment allows users to program any appropriate cutting path or pattern. This includes tangential, serpentine, and stepped features to enable the cutting of complex profiles. The system is also designed with a 6-axis, adjustable cutting depth tool head to allow for versatile complexity in cuts. The scriber/dicer allows for a non-contact method of processing, which eliminates secondary processes such as deburring and polishing, as well as reducing material waste. The unit is also capable of annealing the substrate in order to soften material prior to the cut, which can improve the quality of the cut lines and further reduce post-processing requirements. DISCO DFD6362 scribing/dicing machine is the solution for providing high quality, repeatable cuts on various demanding process applications. Its full flexibility and ease of use allows it to be used in various industries such as the electronics, composite, and biomedical fields.