Used DISCO DFD 640 #293585679 for sale

DISCO DFD 640 is a scribing and dicing equipment designed specifically for the semiconductor industry. It enables the efficient slicing of large semiconductor wafers into pieces of a predefined size. This system provides automated wafer slicing and dicing operations, as well as highly precise cutting and damage-free separation of various semiconductor materials. DISCO DFD640 uses a numerical control (NC) mechanism to accurately move the cutting knife along a predetermined trajectory. This unit employs an NC mechanism that adjusts the cutting position in the X, Y and Z directions. The cutting knife, which is controlled by NC, is made of special, heat-resistant steel and can be exchanged depending on usage. The machine utilizes an optical measuring head to monitor the process and ensure high-precision slicing and dicing operations. DFD 640 is based on a multi-stage process for maximum cutting accuracy and reliability. During the first stage, the wafer is illuminated by a laser light source and the marking patterns are detected by an optical detector. The second stage is cutting the marked areas by rotating the cutting knife while the wafer is fixed at the cutting position. Another benefit of the second stage is that it reduces the vibration of the cutting process and enhances cutting performance. DFD640 also features a touch panel controller that simplifies setup and reset of the tool. This touch panel features a graphical user interface (GUI) that displays various parameters and allows operators to change settings quickly and easily. In addition, it provides a variety of functions such as asset monitoring, automatic positioning of the cutting blade, and wafer cutting angle selection. For safety, DISCO DFD 640 has smart safety functions such as safety curtains that prevent body parts from coming in contact with the cutting blade. Furthermore, this model can detect any attempt to open the cutting position control chamber and will automatically stop the cutting knife. Overall, DISCO DFD640 is an advanced scribing and dicing equipment that offers enhanced cutting performance and improved safety. With its numerical control system and advanced features, this unit is ideal for cutting large semiconductor wafers with high accuracy and reliability.