Used DISCO DFD 640 #293602399 for sale

DISCO DFD 640 is a state-of-the-art scribing / dicing equipment that provides automatic and efficient processing of wafers into discrete pieces. This unit uses a combination of wire cutting, scribing, and saw/laser cutting to precisely cut thin slices of material from the original substrate. The machine allows for rapid loading, scribing, and unloading of wafers, providing versatile and reliable processing in sensitive processes. DISCO DFD640 is composed of a large base and several attachment modules. The base unit houses a scribe head, three rotary stages, a resin-coating station, and several optical components. The scribe head holds diamond-tipped blades of various shapes and sizes to allow for precise cutting. The rotary stages are used to adjust the rotational position of the wafers and are driven by air-bearing motors. The resin-coating station is used to apply thin films of liquid medium to the surface of the wafer. The optical components are used to detect imperfections and defects in the material, providing accurate and consistent results. DFD 640 is designed to process wafers with a maximum diameter of 6 inches (15 cm). It is capable of fine scribing operations from 1 micron with a minimum line width of 25 microns. The machine also features a three-dimensional alignment system to ensure optimal results. This allows for precise positioning of the blades for improved accuracy and repeatability. DFD640 also has advanced safety features. It utilizes pressure and temperature sensors to alert operators when dangerous conditions are approaching. It also has an advanced dust management unit which helps to minimize contamination and damage to the wafers. Overall, DISCO DFD 640 is an excellent machine for controlled scribing and dicing operations. Its advanced features, coupled with its precise cutting and accurate alignment capabilities, make it an ideal choice for sensitive processes. Its reliable performance, combined with its easy maintenance steps, make it the ideal tool for processing wafers into discrete pieces.