Used DISCO DFD 640 #293604914 for sale

DISCO DFD 640 is a unique scribing and dicing equipment. This system employs a combination of laser and mechanical technologies to cut intricate patterns into a wide range of materials. These materials include glass, ceramics, and silicon. The combination of technologies allows for the precise control needed for today's advanced production processes. To start, DISCO DFD640 is equipped with three subsets of technologies: laser scribing, semi-coaxial laser scribing, and laser dicing. The scribing technologies used provide accuracy and repeatability while the coaxial version is designed to give higher fidelity control over designs. Laser dicing is used to cut into tightly packed materials such as ceramics and glass. This allows for more intricate and intricate patterns to be produced. Upon entering the device, the material to be etched is broken into three main components. These components are the substrate, the laser irradiation unit, and the cutter. The substrate is what the laser will be focused on, while the laser irradiation machine controls the position and focus of the laser. Finally, the cutter contains a set of razor-sharp blades that passes over the material and gently cuts into it. With this combination of technologies, DFD 640 is able to produce intricate scribing and dicing designs. Examples of these designs include small features for wafer-level packaging, mounting holes for lenses, and vias for circuit boards. All of these are done with great accuracy and to a high quality. Overall, DFD640 is a powerful and reliable tool for scribing and dicing operations. The addition of laser and mechanical techniques allows for the precise cutting of intricate patterns, making it amenable for the production of high-end products. Additionally, its easy-to-use design makes it applicable to many different scenarios, making it a staple in the semiconductor industry.