Used DISCO DFD 640 #293605145 for sale

DISCO DFD 640 is a scribing and dicing equipment that is specifically designed for use in the semiconductor industry. DISCO DFD640 offers a reliable, cost-effective solution for cutting chips, wafers, and other substrates into individual parts for use in a variety of applications. The system utilizes a patented approach to recognize both isolated and distinct parts in a larger substrate and accurately cut them into individual components. The unit consists of a motorized head carriage that is compatible with a wide range of tooling, allowing it to handle almost any substrate size and shape. It also features an integrated vision machine to enable precise positioning of both the tooling and the substrate. The combination of these two components makes it easy to accurately cut substrates into the desired part shape. Additionally, the tool is equipped with a laser-based marking asset, which can be used to mark individual parts with alignment marks or to create custom shapes on the substrate. The model can be used to cut a variety of materials with a range of precision requirements. It is capable of producing high-quality dicing of semiconductor wafers with many cut sizes and configurations, as well as scribing for create individual circuits and components. Additionally, DFD 640 has a wide range of safety features, including protective coverings for the head and tools, built-in contaminant monitoring, and an automatic fail-safe equipment to automatically shut down the system in the event of any danger. DFD640 is an ideal scribing and dicing unit for any high-precision production environment. Its advanced feature set provides accurate and reliable performance, while its built-in safety features ensure that it is safe to use in a production environment. Overall, DISCO DFD 640 is an excellent choice for companies looking for a cost-effective, reliable scribe and dicing solution.