Used DISCO DFD 640 #293641777 for sale

DISCO DFD 640 is a high-accuracy, non-contact scribing / dicing technology that leverages a Femtosecond (FS) laser to offer precise separation of labeled electronic components from a flat-panel substrate. By using the FS laser, it is possible to separate a substrate at a submicron level without creating any damage to the substrate itself. DISCO DFD640 uses a beam diameter of less than 8µ to accurately separate aluminum-encapsulated electronic components from the substrate. DFD 640 is a highly accurate and efficient piece of equipment and consists of four core components: Laser, XY Stage, Control Unit and Light Source. The laser component of DFD640 is capable of producing high frequency laser pulses at a wavelength of 532nm with a pulse rate of up to 80MHz. This enables precise separation of the aluminum electroplated substrate in both the X and Y dimensions. The XY stage component provides extremely precise positioning of the substrate as the laser works its way across the panel, while the control unit is responsible for the adjustment of the laser parameters and the operation of the equipment overall. The light source component is used to provide illumination of the substrate which enables maximum visibility of the cutting line. DISCO DFD 640 is designed to work with a wide range of materials, including silicon, quartz, ceramics, PET, glass and laminated substrates. This allows for the separation of even the most complex substrates. DISCO DFD640 is also simple to setup and operate, allowing operators to quickly and easily adjust the laser parameters and cutting field parameters to precisely separate a substrate. Overall, DFD 640 is an advanced and highly precise scribing / dicing system capable of delivering exceptionally accurate separation of substrates, even those with complex geometries. By combining the power of its Femtosecond laser with a well-designed control unit, XY stage, and light source, this unit can separate substrates at a micron level with minimal material damage. The machine is also very easy to setup and operate, making it ideal for those who require precise and accurate separations from a substrate.