Used DISCO DFD 640 #9100645 for sale

DISCO DFD 640
Manufacturer
DISCO
Model
DFD 640
ID: 9100645
Wafer Size: 4"-8"
Vintage: 1996
Dicing saw, 4"-8" 1996 vintage.
DISCO DFD 640 is a high-performance scribing / dicing equipment used for a variety of cutting and marking applications. This versatile machine is capable of cutting or scribing/dicing all types of materials, from semiconductor substrates, to glass, ceramic and metals. DISCO DFD640 is a multi-axis system, capable of five-axis motion. It features a high-speed, high-precision motor that provides precise scribing and dicing operations with fast speed, even at maximum laser power. The integrated motor and control unit enables high-precision motion and fast speed, as well as precise scribing and dicing. The laser source features an adjustable laser power setting that allows the user to adjust the laser power for optimal results. DFD 640 features an advanced computer-controlled driving and controlling machine, which ensures consistent and accurate performance during multiple operations. This tool is capable of monitoring accelerations and airflow for a precise, consistent cutting or scribing process. The integrated laser asset is equipped with a full range of lenses and nozzles, enabling the model to accurately focus the laser to the material. DFD640 also includes an automated optical registration equipment. This feature enables the system to automatically detect alignment marks on the substrate to ensure precise scribing and dicing operations. This unit is equipped with a vacuum chamber for precise positioning of the substrate for cutting and scribing operations. The vacuum chamber is also equipped with active filtration, allowing the chamber to maintain a clean environment and extend the lifespan of the machine. DISCO DFD 640 is an ideal choice for companies that require a precise and efficient scribing/dicing process. Its combination of advanced features and reliable performance ensures precision and reliability in a variety of cutting and scribing operations. This tool is ideal for applications such as dicing and scribing semiconductor substrates, glass components and electronic packages.
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