Used DISCO DFD 640 #9100646 for sale
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DISCO DFD 640 is a scribing and dicing equipment designed by D.I.S.C.O., a Japanese corporation, for the creation of semiconductors in the fabrication process. This system is designed to produce semi-automatic, high-precision thin film deposition, and "dice-saw cut, scribing and smearing" processes all in one unit. The machine's design also allows for the processing of multiple ICs and substrates simultaneously. DISCO DFD640 tool is modern in design, made up of several precision modules, micropositioners, motors, and optics that can be easily adjusted, customized, and maintained. The asset's configuration is highly flexible, allowing users to customize it to fit their production needs. The model includes three key components - a thin film deposition chamber, a scribing stage, and a dicing stage. The thin film deposition chamber is responsible for producing high-resolution thin films that can be used in the creation of semiconductors. The scribing stage uses a laser to precisely scribe lines into substrate ICs. The dicing stage then uses a diamond saw to cut the ICs into individual parts. DFD 640 equipment is part of a larger process control system known as IPCE (Integrated Process Control Equipment). IPCE allows the user to monitor and control the production process remotely. This unit makes it easier for the user to track production and monitor changes in the production process. It also allows for diagnostics and data collection. Overall, DFD640 is an impressive machine that can be tailored to suit the needs of any semiconductor manufacturer. With its high-precision thin film deposition, laser scribing, and diamond dicing capabilities, the tool provides advanced process control that ensures high yields and quality. The combination of IPCE, a detailed monitoring and control asset, makes it one of the most advanced scribing and dicing systems on the market.
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