Used DISCO DFD 640 #9119599 for sale

DISCO DFD 640 is an advanced cutting and scribing equipment, frequently used in the semiconductor industry. This system is capable of cutting and scribing a wide variety of materials with precise accuracy, enabling it to be used for a wide array of cutting and grinding applications. Its powerful laser-dicing unit enables quick and accurate preparation of wafers with minimal damage. DISCO DFD640 utilizes a high speed centrifugal fan to spin the wafer before and during operations, holding it securely in place for high-precision cutting. The machine also makes use of a built-in vision tool to ensure accurate alignment of the cutting blade against the wafer surface. This combination of both the air bearing and vision asset guarantees maximum accuracy when positioning and cutting the wafer. The model also features a patented beam shaper to eliminate distortion in the laser-cutting process, while also providing repeatable results with minimal pixel shift. This feature enables higher scribing accuracy as this laser beam is finer and more precise than traditional blades. Additionally, the equipment is equipped with a motorized Z-stage and motorized XY stages, ensuring smooth and jerk-free movements, as well as providing precise control of depth and position. The superior cutting and scribing technology of DFD 640 make it the ideal choice for a range of applications, such as wafer back-grinding, wafer dicing, edge-grinding, and wafer-thinning. It is also incredibly versatile and its superior performance has been proven to be time and cost-efficient. Fast, precise and economical, DFD640 system gives users the ability to cut and scribe with utmost accuracy and speed, as well as providing high yields in multiple applications.