Used DISCO DFD 640 #9158353 for sale

DISCO DFD 640 is a "scribing and dicing" equipment designed to cut and separate wafers into individual chips with precision. It utilizes diamond-tipped scribing blades to make a series of radial and linear cuts along the surface of a silicon wafer, resulting in a clean break and a minimal number of damaged chips. The system provides high-speed, high accuracy cutting and individuation of wafers up to eight inches in diameter. In addition, the machine is designed to maintain consistent thickness and even size of each chip. The basic setup of the unit consists of a motorized XYZ stage, a linear motor, and a spindle motor. The XYZ stage is used for positioning the wafer for the scribing and dicing process. The linear motor is used for controlling the movement of the scribing heads along the surface of the wafer. The spindle motor is used for fine-tuning the alignment between the scribing head and the wafer. DISCO DFD640 is equipped with several features that make it an ideal choice for precision wafer dicing and scribing applications. The machine features a high precision feedback control machine for scribing accuracy, as well as a high torque power drive for increased productivity. The scribing heads are mounted on a fixed base, which helps to ensure consistent angle accuracy. The tool is also capable of accommodating a variety of cutting tools, including round scribing blades, crescent-shaped cutting blades, and diamond-tipped scribing blades. The accuracy and precision of DFD 640 asset is achieved through the implementation of advanced control systems. These systems utilize an Optical Laser Displacement Sensor (OLFD) that employs a high-power laser to accurately measure the movements of the XYZ stage and the scribing heads. The model can also incorporate a wafer strain gauge to detect changes in wafer thickness, as well as a wafer tilt detector to ensure the wafer remains even during the scribing process. DFD640 equipment is a highly reliable and efficient solution for dicing and scribing semiconductor wafers. Its high accuracy, consistent performance, and advanced features allow for reliable production of individual chips with minimal damage or contamination.