Used DISCO DFD 640 #9197102 for sale

DISCO DFD 640 Equipment is a highly automated and precise scribing/dicing tool for the semiconductor industry. This advanced machine efficiently processes wafers up to 200mm in diameter at speeds of up to 80 WPH (wafers per hour). The system provides superior accuracy, repeatability and cost-effectiveness with the advanced unit control software. The machine is easy to operate and has an easy to use intuitive graphical user interface (GUI). The machine is equipped with a powerful vision tool for precise alignment, x-y-z positioning, and product inspection. All of these features are integrated into a single programmable platform. The asset also offers a wide range of operating parameters such as speed, pressure, temperature and other performance parameters. DISCO DFD640 provides optimal performance with superior return on investment. The machine is robust and highly reliable with a long service life. The model has a flexible processing module for maximum throughput and a wide range of accessories for customizing the tool set. The machine is equipped with a high-resolution camera for accurate placement and a stress relief feature that ensures proper handling and protection of delicate components. For maximum precision and reliable performance, DFD 640 comes with state of the art cutting technology including dicing saws and blade holders. The machine also features an automatic chipping equipment that ensures precise cutting and greater productivity. DFD640 also features advanced artificial intelligence algorithms and adaptive motion control for enhanced accuracy and repeatability. DISCO DFD 640 provides a safe, efficient and high performing scribing/dicing solution for the semiconductor industry. This versatile machine offers superior performance and is easy to operate, maintain and upgrade. The tool is highly reliable and efficient and provides value-added solutions for semiconductor processing.