Used DISCO DFD 640 #9221343 for sale

DISCO DFD 640 is a cutting-edge scribing and dicing equipment from DISCO Corporation. It is an efficient, fast and reliable semiconductor dicing system that was first released in 2003 and is still in use today. DISCO DFD640 offers a dicing width of under 1mm and a dicing speed of 40 mm/sec. This allows for a rapid, high-accuracy dicing process for easily cutting delicate and expensive semiconductor substrates. DFD 640 can also work with very thin wafers less than 0.2mm in thickness, with the dicing pitch as low as 25um, making it perfect for precision semiconductor applications. The unit is suited for a wide range of materials, including silicon, quartz, sapphire, SiC or various metal substrates. It supports both non-contact (ultrasonic) and contact (blade) methods of scribing and dicing, and also features automated chipping to streamline the process. Special slices can also be specified using its flexible cutting pass control setting. The machine has an integrated optical microscope, making is convenient for inspecting the sliced slice without having to undo the whole tool setup. It also features an Exhaust Amount Control tool that adjusts the air pressure of the air flow to prevent excessive dicing chips from accumulating on the substrate. DFD640 is a reliable, economical and easy to use asset that offers superior precision and accuracy. It requires minimal maintenance and is suitable for high-precision dicing of a wide range of substrates. With its automated integration, it speeds up the process with little need for manual manipulation, making it a great choice for busy workshops.