Used DISCO DFD 640 #9248187 for sale

DISCO DFD 640 is a precision scribing/dicing equipment designed for high yield production of substrates such as semiconductor wafers, LCD substrates, car key displays, and more. This system achieves high throughput dicing for substrates up to 150 mm using a Dual Frequency Diamond Disc (DFD) technology, providing a much greater processing speed than conventional diamond wheel dicing systems. The unit consists of a rotating optical encoder attached to a dicing spindle, and a precision X-Y stage to move the substrate. The optical encoder is used to detect the speed and position of the DFD wheel. This provides extremely precise control over the cutting speed and length of the dicing process. The X-Y stage utilizes a three-axis linear motor drive to accurately position and control the substrate. Together these two components create a highly precise and precise dicing environment. The machine is also equipped with a laser beam to detect the exact position of the scribe-mark or cut lines on the substrate. This ensures that the scribe-mark or cut lines are precisely placed in respect to the substrate. This makes it possible to achieve the desired scribe-mark or cut lines with a higher degree of accuracy, even when dealing with multiple substrates at once. Additionally, a laser sensor is used to detect any debris or particles that are generated during the dicing process. This allows the tool to detect and remove any particles that could disturb the process, ensuring a high quality and reliable output. In addition to the intelligent control of the components, DISCO DFD640 asset is also equipped with an array of safety features. This includes multiple obstacle detection systems, dust-controls that filter harmful particles, and self-calibration features that maintain optimal performance over time. Overall, DFD 640 is a cutting-edge precision scribing/dicing model that provides tremendous performance and reliability. Through its cutting-edge technology, the equipment is designed to reduce downtime, improve material yields, and enable the highest quality cutting possible.