Used DISCO DFD 640 #9260614 for sale

DISCO DFD 640 is a scribing and dicing equipment that is used for the cutting of thin materials like semiconductor wafers and precision parts. It has a maximum 12-inch rotary table that allows for the cutting of wafers of a wide variety of sizes and shapes. The system is equipped with four diamond scribes featuring a control unit that ensures accurate and uniform cutting. The scribes also feature an enlargement and rotation compensation machine which allows for the cutting of wafers in any orientation. In addition, the tool also features a "pick-and-place" scheme for easy loading and unloading of the wafers. DISCO DFD640 is equipped with various other cutting functions, such as engraving and punching. The asset is supplied with a hollow diamond blade capable of producing 0.3-3mm diameter cuts for the creation of high-precision channels and trenches. The model is also able to handle multiple cutting materials such as semi-conductor material, plastic, glass, aluminum, and steel. All of these features come together to give DFD 640 the ability to perform precision micro cutting operations. The equipment also features a wafer thinning process, which allows a wafer to be reduced in thickness while still maintaining its strength. This is done through the use of a hollow wafer tape and a spindle-cutter combined with a vacuum hold-down system. The wafer tape is inserted into the unit and held in place with a vacuum. Then the spindle-cutter passes over the wafer, thinning it in a uniform and consistent motion. DFD640 also features a TFT display with navigation touch keys for easy programming and operation. The machine also offers multiple languages for operation, as well as memory backups and test functions. For added safety and convenience, the tool also comes with a built-in emergency stop button. Overall, DISCO DFD 640 is an outstanding asset for precision cutting of thin materials such as semiconductor wafers, cutting various materials in any orientation, and wafer thinning. Thanks to the advanced control systems, high quality diamond scribes, and various safety features, this model is perfect for performing precision micro-cutting operations.