Used DISCO DFD 640 #9260615 for sale

DISCO DFD 640 is a powerful scribing / dicing equipment designed to quickly and effectively fabricate wafers. It offers high-speed cutting and patterning with a wide range of sizes for diverse applications. With its high processing speed and precision, DISCO DFD640 is ideal for applications requiring cutting of line widths and up 500 μm and line heights up to 3 microns. The system utilizes a unique cutting head with a large diamond-tipped scriber that is precisely controllable and can move laterally, allowing hard-to-reach places to be reached quickly. The cutter also has a vibration damper to reduce any potential vibrations and a self-driven suction holder to hold the wafer in place and guarantee performance. The environment created by the head is both vibration-free and dust-free to ensure optimal cutting of the wafer. The unit is fully automated, with a large-capacity loading/unloading tray for easy handling, as well as a variable-speed motor for precise automation. Moreover, DFD 640 offers various cutting options, such as one-way and two-way cutting from which the user can choose. This allows the user to design custom patterns and to easily change cutting angles, speeds and directions depending on the desired output. Other features of the machine include a variety of ECD calibration assessment features, comprehensive operational safety features including safety interlocking and emergency stop, temperature control and measurement capabilities, and a dust cover to keep dust away when the machine is not in use. DFD640 is a versatile scribing/dicing tool which offers users a range of dicing capabilities for various applications. It has a large-volume loading/unloading tray, a powerful cutting head, as well as a range of safety features to ensure maximum safety. With its high precision and remote access capabilities, DISCO DFD 640 is an ideal solution for cutting wafers with exact measurements.