Used DISCO DFD 640 #9278900 for sale

DISCO DFD 640
Manufacturer
DISCO
Model
DFD 640
ID: 9278900
Vintage: 1995
Dicing saw 1995 vintage.
DISCO DFD 640 is a highly advanced automated scribing and dicing equipment for semiconductor wafer processing. This system is capable of high-precision scribing on a wide range of wafer thicknesses, shapes, and materials, enabling high-performance dicing with reduced chipping and stress. The unit is capable of cutting up to 40μm deep, with scribe lines accurate to tens of nanometers, and a maximum scribe speed of 1.4m/s. It is also equipped with a wafer tension-release mechanism and a set of independently adjusted vacuum systems that enable precise processing accuracy from edge to edge. DISCO DFD640 is based on unique laser scribing technology, providing unmatched precision and speed, while avoiding the problems associated with traditional technologies, such as mechanical blades and saws. It utilizes a solid state laser and a powerful control machine to provide high accuracy, repeatability, and sustainability. The control tool can be easily programmed with basic parameters and graphical user interfaces, allowing for fast and easy optimization of the process. The asset also comes with a two-step indexing mechanism, allowing precise positioning and improved uniformity of scribed lines. Its efficient cubic motion ensures accurate laser placement and smooth operation. The model is integrated with precise, sophisticated viewports and a cutting sensing device, enabling easy visualization and precise cutting. Finally, the equipment is equipped with a novel cooling system and a chiller that are configured to deliver precise temperatures and pressure throughout the laser scribing process. This helps to maintain precise cutting parameters and reduce down time due to thermal and pressure changes. The unit also provides enhanced safety with a highly visible laser beam indicator, and a built-in safety beam guard for active laser monitoring. All in all, DFD 640 is an excellent machine for automated semiconductor wafer processing, providing high accuracy and repeatability, and with unique features such as a temperature-controlled cooling tool, a two-step indexing mechanism, and a built-in safety beam guard. It is a robust, reliable asset that is easy to use and maintain, and provides excellent performance and value for money.
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