Used DISCO DFD 640 #9361753 for sale
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DISCO DFD 640 is a high-speed scribing/dicing equipment designed for cutting, slicing, and separating various types of thin materials such as thin glass, silicon wafers and thin metal. The products of DISCO DFD640 deliver good precision and repeatability, fast processing and high yield. The machine utilizes a pair of high-power laser output beams to accurately scribe an intricate pattern along the entire length of the material. A high speed, ultra-precise synchronous scrolling stage accurately positions and drives the material during the cutting cycle. This synchronous scrolling stage is equipped with specialized encoders for continuous position verification and for compensating errors caused by misalignment during processing of multiple sheet materials. It is also equipped with an advanced integrated software system developed specifically for this application. Additionally, the machine is equipped with an air knife to cut and separate each sheet as they are moved along the cutting surface. It utilizes a single-point staging beam to form a continuous flow of material through the scribing and separating process. The scribing and dicing process is monitored and controlled by a high resolution camera equipped with an automated focus unit. This camera can automatically adjust the focus of the laser beam and the forming knife according to varying material thicknesses. The machine is capable of operating in both a semi-automatic mode and an automatic mode. In semi-automatic mode, the user manually sets the parameters for the desired scribing and slicing sequence. In automatic mode, the machine automatically sets the parameters and executes the processes with no user intervention required. Furthermore, DFD 640 is equipped with a defect inspection machine. It monitors the material during slicing, scribing and cutting, and identifies and rejects abnormal or defective pieces. The rejection process is carried out automatically and can be based on multiple criteria, including visual inspection and material thickness. The machine is also equipped with advanced user-friendly software, which allows users to instantly check the process parameters, monitor the cutting and slicing sequence, view defect images, check cutting and scribing speeds, and check precise cutting heights and speeds. Overall, DFD640 is a reliable, high-speed, precise scribing and slicing tool which is designed for precise cutting, slicing and separating of thin materials such as thin glass, silicon wafers and thin metal. It processes materials rapidly, with consistent results and an excellent yield.
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