Used DISCO DFD 640 #9361754 for sale

DISCO DFD 640 is a world-leading scribing / dicing system for high-precision wafer processing. The unit offers a range of features, including precise mechanical scribing, air dicing / laser dicing, and vacuum-assisted cutting. In addition, it can be used for a variety of materials, including: Silicon, SiO2, Si3N4, quartz, and ceramics. DISCO DFD640 features a high-resolution camera system that ensures the unit can accurately identify features in the material, allowing for precise scribing and cutting. In addition, the intuitive user interface allows operators to quickly program the unit, while the software package allows for remote monitoring and control. The unit is ultra-fast, completing a scribing cycle in as little as 0.1 seconds, and a dicing/cutting cycle in as little as 0.5 seconds. This makes DFD 640 perfect for high-volume wafer-processing projects, where speed is of the essence. In addition, the unit has three axis of motion to enable wider cutting paths when needed. The various cutting tools are designed to be quick and easy to change out, reducing changeover times and allowing operators to quickly switch between different projects. The scribing tool has been designed to ensure long lasting performance, even when used on hard materials like SiO2 and Si3N4. DFD640 is feature-packed, offering a number of manufacturing solutions to improve quality and profitability for wafer-processing operations. The unit is available in two sizes, with a 600mm x 600mm (23.6″ x 23.6″) platform or a 300mm x 300mm (11.8″ x 11.8″) platform. Both models feature robust construction, allowing them to stand up to the rigors of high-volume operations. Overall, DISCO DFD 640 is a powerful scribing / dicing system that combines a range of features and flexibility to ensure the highest-quality wafer processing in a fraction of the time.