Used DISCO DFD 640 #9372469 for sale

DISCO DFD 640 is a multi-functional scribing and dicing equipment which offers precision wafer processing to the highest quality standards. Developed for the semiconductor, MEMS, and compound industry, the system features advanced technology that provides superior performance, as well as a wide variety of customisable applications for scribing, dicing, and back grinding operations. DISCO DFD640 is a 2-axis unit, featuring dual linear motors for both the X and Y-axes. The machine is equipped with a high-resolution, direct-drive linear motor that utilises a torque measurement tool to maintain precision control. This ensures that the wafer surface will be free from vibration, which means it can be accurately scribed and diced. The asset is also capable of operating at high acceleration and deceleration speeds, allowing for faster cycle times. For scribing and dicing operations, the model utilises a high-pressure water jet for machining that results in precise and accurate cuts on the wafer surface, with minimum burr formation. The jet pressure is adjustable as needed, and the taper-toleranced nozzle ensures that the pressure is evenly maintained across the entire wafer surface. In addition, the equipment comes with an integrated high-performance vision system which allows the operator to check the product quality and alignment before, during, and after critical processes. This helps to minimise time loss and provides a quality inspection unit that is required in the semiconductor and compound industry. The machine is also designed to be user-friendly, coming with intuitive monitoring and control systems. This allows the operator to easily control the tool and view the process in real time. The integrated monitoring asset also monitors the wafer temperature and automatically reduces processing speed if required, thus preventing damage to the wafer. Overall, DFD 640 is a highly precise and accurate scribing and dicing model that offers advanced technology and customisable applications. With its advanced features and capabilities, the equipment is well-equipped for precise and precise processing with minimal potential for cutting errors and burrs.